Beam Position Monitor (BPM) and sub-assemblies for ALS-U

Project ID: AA-2026-02 FederalOpportunitiesSources Sought
Overview
AgencyDepartment of Energy
Deadline03/09/26
Posted02/27/26
Estimated ValueNot Provided
Set AsideNone
NAICSNot Provided
PSC6640 - Laboratory Equipment And Supplies
LocationBerkeley, CA United States
Description
Primary Latest Change

The University of California, Lawrence Berkeley National Laboratory (LBNL) is conducting market research to identify potential sources that possess the expertise, capabilities, and experience necessary to supply the Beam Position Monitor (BPM) major and sub-assemblies for the Advanced Light Source (ALS-U) project.

Summary (Newest Update)

Background The University of California, Lawrence Berkeley National Laboratory (LBNL) is conducting market research to identify potential sources that possess the expertise, capabilities, and experience necessary to supply the Beam Position Monitor (BPM) major and sub-assemblies for the Advanced Light Source (ALS-U) project. The ALS-U is an upgrade project to the LBNL Advanced Light Source (ALS), which is a 1.9 GeV storage ring optimized to produce intense beams of soft x-rays. This upgrade aims to achieve world-leading soft x-ray coherent flux with a multibend achromat (MBA) lattice design that will significantly increase brightness and coherent light fraction compared to current capabilities. Work Details The contract involves supplying Beam Position Monitor (BPM) major and sub-assemblies, which include: 1. PCB Design / Layout Capabilities: - Indicate whether PCB layout is performed in-house or by a subcontractor. - List CAD tools utilized (e.g., Altium, Cadence, Mentor). - Experience in high-speed digital, RF/analog, mixed signal, high-voltage, controlled impedance designs. - Stack-up capabilities including layer count limits and via types. 2. PCB Fabrication Capabilities: - Fabrication limits for layer count, trace width/spacing, via size. - Controlled impedance tolerance and supported material types (e.g., FR-4, Rogers). 3. PCB Assembly: - SMT and through-hole capabilities; fine-pitch BGA capability; inspection options like X-ray and AOI; rework capability; functional testing; cleanliness standards; lot traceability system; ESD controls. 4. Testing & Quality: - Details on testing capabilities and quality standards such as ISO certifications and IPC certifications. 5. Chassis & Integration Capabilities: - Mechanical fabrication capabilities including sheet metal work, CNC machining, cable harness fabrication, rack integration capability. Place of Performance Lawrence Berkeley National Laboratory

Contacts
Contact nameArielle Anoop
Contact emailaanoop@lbl.gov
Contact phone(510) 486-5519
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