CHIPS R&D Custom Diffractometry and Fourier Ptychography Endstation

Summary (Newest Update)

Background The Nanoscale Device Characterization Division (NDCD) is part of the National Institute of Standards and Technology (NIST) and focuses on advancing measurement capabilities for nano- and atom-scale engineered materials. This contract aims to acquire a customized diffractometry end station to enhance measurement capabilities using extreme-ultraviolet (EUV) light, addressing the need for non-destructive three-dimensional measurements of nanoscale features in semiconductor manufacturing. The procurement supports the CHIPS R&D Metrology Program's Grand Challenge 2, specifically project 2.07, 'EUV Scatterometry.' Work Details The contractor shall provide a Custom Diffractometry and Fourier Ptychography Endstation that includes: - A custom vacuum chamber body (40"x40", height 24") capable of high vacuum (10^-6 Torr). Materials must be stainless steel or aluminum. - Viewports including ISO bulkheads and KF bulkheads. - A sample stage with an electrostatic chuck for 300 mm silicon wafers, with specified degrees of freedom and resolutions. - An optical/camera stage with a vertical arc arm and motorized stages for camera positioning. - A full in-vacuum EUV camera with specific resolution, frame rates, and cooling requirements. - An adjustable base for height adjustment next to the source optical table. All items must be new, with no used or remanufactured equipment accepted. Period of Performance 13 months from the date of award. Place of Performance National Institute of Standards and Technology, 100 Bureau Drive, BLDG 301 (Receiving), Gaithersburg, MD 20899. Bidder Requirements The contractor must provide all components as new; used or remanufactured equipment will not be considered. The use of 'gray market' components is unacceptable. The contractor must also provide computer-aided design (CAD) files for the chamber specifications and ensure compliance with high vacuum standards.