Plasma Cleaning System

Summary (Newest Update)

Background The Defense Microelectronics Activity (DMEA) is issuing a solicitation for a Plasma Cleaning System to support the Packaging Assembly and Substrates (PAS) Lab. The PAS Lab fabricates developmental, prototype, and production high voltage devices and enclosures for Department of Defense (DoD) customers. The goal of this contract is to procure a plasma cleaning system that meets the increasing variety and thermal sensitivity of packaging materials, which are critical for achieving strong attachments in integrated circuit and PCB assembly projects that comply with MIL-STD-883. The current legacy plasma cleaning system is inadequate for these needs. Work Details The contract includes the following items: - CLIN 0001: OPENAIR Plasma System - Quantity: 1 EA - CLIN 0002: Shipping - Quantity: 1 Lot - CLIN 0003: Annual Support - Quantity: 1 Year The total contract cost will be determined based on the pricing provided by the contractor. All terms, conditions, solicitation provisions, and contract clauses listed in this Combined Synopsis/Solicitation Form will be incorporated into any resulting contract. Place of Performance McClellan, California