Purchase of silicon-based photonics integrated circuit (PICs) for laboratory testing for the AstroPIC project.

Project ID: 80NSSC26936131Q FederalOpportunitiesSynopsis Solicitation

Overview

Agency	Shared Services Center
Deadline	06/22/26
Posted	06/16/26
Estimated Value	$40,000 - $120,000 (AI estimate)
Set Aside	None
NAICS	334413 - Semiconductor and Related Device Manufacturing
PSC	6695 - Combination And Miscellaneous Instruments
Location	NASA Ames Research Center Moffett Field, CA 94035 USA

Description

Primary Latest Change

Summary

NASA/NSSC has a requirement for Purchase of silicon-based photonics integrated circuit (PICs) for laboratory testing for the AstroPIC project. NASA/NSSC intends to issue a sole source contract to Applied Nanotools under the authority of FAR 12.102(a). It has been determined that Applied Nanotools 11421 Saskatchewan DR NW 4th Fir Edmonton ab T6G 2M9 Canada is the sole provider of Purchase of silicon-based photonics integrated circuit (PICs) for laboratory testing for the AstroPIC project. NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Ames Research Center (ARC). The Government intends to acquire Commercial items or services using the provisions, clauses and procedures prescribed in FAR Part 12 for Commercial The NAICS Code for this procurement is 334413. Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 3:00 PM. Central Standard Time on 6/22/2026. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications are not acceptable in response to this notice. NASA FAR Supplement Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at https://www.hq.nasa.gov/office/procurement/regs/Procurement-Ombuds-Comp-Advocate-Listing.pdf .

Primary Point of Contact

Kacey Hickman Kacey.l.hickman@nasa.gov

Summary (Newest Update)

Background NASA/NSSC has a requirement for the purchase of silicon-based photonics integrated circuits (PICs) for laboratory testing for the AstroPIC project. NASA intends to issue a sole source contract to Applied Nanotools, located at 11421 Saskatchewan DR NW 4th Fir Edmonton, AB T6G 2M9, Canada, as they are determined to be the sole provider for this requirement. The NASA Ames Research Center will be the procuring center for this effort. Work Details Applied Nanotools (ANT) shall deliver a total of 56 photonic integrated circuit devices based on the following NASA provided silicon photonic layout design files: - ant_apr26_121_ACHIP.gds – 4 copies diced into 12 dies - ant_apr26_121_AstroPIC_main.gds – 12 copies diced into 12 dies - ant_apr26_121_AstroPIC_secondary.gds – 4 copies diced into 4 dies - ant_apr26_121_BBDC.gds – 4 copies diced into 4 dies - ant_apr26_121_grating.gds – 4 copies diced into 4 dies - ant_apr26_121_Grating_pp.gds – 4 copies diced into 4 dies - ant_apr26_121_MEMS.gds – 4 copies diced into 4 dies - ant_apr26_121_PCLA.gds – 4 copies diced into 4 dies - ant_apr26_121_Polarization.gds – 4 copies diced into 4 dies - ant_apr26_121_SPEC.gds – 4 copies diced into 4 dies. Each PIC device will have the following specifications and fabrication tolerances: - All devices will be Silicon-on-Insulator (SOI) material. - Partial etch (layer 2) with a depth of 70nm (±10nm), with pattering of gratings and partial etching down to custom etch depth. - Full etch (layer 1) at a depth of 220 nm with patterning of waveguides and etching down to the buried oxide (BOX) layer. - Oxide cladding: thickness of 2.2 +/- 0.2 microns, deposited using plasma-enhanced chemical vapor deposition (PECVD). - Tri-layer metallization for thermal phase shifters and deep trench process for thermal isolation on applicable devices. TiW and Au layers on five wafers total. - For devices containing Micro-Electro-Mechanical Systems (MEMS): direct metallization, via openings, MEMS release, and deep trenches for thermal isolation. Period of Performance Delivery approximately 16 weeks after receipt of order. Place of Performance NASA Ames Research Center, Building N255 Central Receiving, Moffett Field, CA 94035, United States. Bidder Requirements Applied Nanotools is a registered entity with ID#: J3Q3ARBLN3H3.

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