Packaging Support Engineer

Summary (Newest Update)

Background The National Aeronautics and Space Administration (NASA) is issuing this Request for Quotation (RFQ) for a Packaging Support Engineer to assist with specific projects at the Goddard Space Flight Center. The goal of the contract is to provide engineering support in the design, bonding, packaging, and analysis of test articles, particularly for the PRobe Infrared Mission for Astrophysics (PRIMA) project and the NexGen Micro-Shutter Array (NGMSA) project. Work Details The contractor will perform various tasks including: - Supporting the design, flip-chip bonding, packaging, and analysis of test articles in cleanroom environments. - For the PRIMA project: - Adhesive bonding of five flight-size microlens arrays with Kinetic Inductance Detector arrays using flip-chip bonding methods. - Tasks include releasing microlens arrays from carrier wafers post anti-reflection layer deposition, cleaning bonding surfaces using a microscope and brush, applying adhesive and aligning parts to ±3 µm using SET FC300 High Precision Die / Flip Chip Bonder, assessing bond quality through infrared imaging and surface profile measurement, and packaging hybrids for shipment. - Timeline for hybrid completion: first within 2 weeks ARO, second within 4 weeks ARO, third within 7 weeks ARO, fourth within 9.5 weeks ARO, fifth within 52 weeks ARO. - For the NGMSA project: - Establishing standard operating procedures for indium bump bonding based on device requirements. - Conducting pre-bonding inspections and cleaning suggestions, performing indium bump bonding for micro-shutter array devices, measuring bond gaps with inspection tools, and providing post-bonding reports. Place of Performance The work will be conducted at the Goddard Space Flight Center cleanrooms located in Stennis Space Center, MS.