Award Notice: Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture

Overview
AwardeeAuburn University
Award ID1333ND26CNB030008
Reported Award$1,000,000
AgencyNational Institute of Standards and Technology
Award DateApril 28, 2026
PostedMay 20, 2026, 9:51 a.m. EDT
Set AsideNone
NAICS541713 - Research and Development in Nanotechnology
PSC5961 - Semiconductor Devices And Associated Hardware
Place of PerformanceBoulder, CO 80305 United States
Description
Primary

The contract action was fixed-price and non-competitive because only one responsible source and no other supplies or services will satisfy agency requirements.

Contacts
Contact nameNina Lin
Contact emailnina.lin@nist.gov
Contact phoneNone
Secondary contact nameDonald Collie
Secondary contact emaildonald.collie@nist.gov
Secondary contact phoneNone
Same Region Opportunities